Copper core PCB is a circuit board processed by pure copper copper clad laminate, which is a kind of metal core PCB. Its thermal conductivity is many times better than that of aluminum substrates and iron substrates. It is suitable for high-frequency circuits and areas with large changes in high and low temperature, as well as heat dissipation of precision communication equipment and architectural decoration industries.
Copper core PCBs are divided into single-sided copper core PCB and double-sided copper core PCB according to the number of layers., and the copper core PCB is also divided into according to the process ENIG copper core PCB, silver plated copper core PCB, HASL copper core PCB, OSP copper core PCB, thermoelectric separation copper core PCB. The circuit layer requires a large current-carrying capacity, so thicker copper foil is used, and the thickness is generally 35μm to 280μm.
The minimum drilling diameter of copper core PCB needs to be 0.4mm, because the copper base is thicker, and the thickness of the copper foil on the copper base PCB determines the line width and spacing.
Contact Us Send Email cathy@beton-tech.com to UsCopper Core PCB is mainly composed of copper substrate, polymer layer and copper circuit layer. The base material of the copper substrate is generally copper, because its heat dissipation effect is better than that of aluminum and iron.
Copper core PCB is a PCB of copper substrate + insulating layer + copper circuit layer, also known as copper substrate, copper-based PCB, and copper clad laminate. As a Metal Core PCB manufacturer, we produce various copper core PCBs for our customers, which are used in high power LED lights (1000W+) and power supplies.
Copper Substrate: The copper substrate is the mechanical support of the copper-based PCB and conducts heat. The thickness of the line copper foil is from loz to 10oz, and the insulating layer is a heat-resistant insulating material
Polymer Layer: A polymer composed of alumina and silica fume, filled with epoxy resin. The polymer layer is located between the copper substrate and the circuit layer. They insulate the different copper layers. Small thermal resistance.
Copper circuit layer: The thickness of the copper foil should be 35μm-280μm, so as to achieve a strong current carrying capacity.
This is copper core PCB with a simple stackup,andits thermal conductivity up to 12 W/m.k.
This is COB Copper PCB which called Chip on Board copper PCB. COB Copper PCB is to dissipate heat directly from the LED chip to the copper substrate.
This copper core PCB is a direct thermal path process, and there is no dielectric layer under the thermal path pad. That is, the copper plating is directly connected to the copper substrate.
This Al-Cu PCB has a direct thermal path without a dielectric layer. The FR4 layer is 0.13-0.2mm thickness. The Aluminum layer is as the substrate, and its thermal Conductivity is Min. 274W/m.k.
This is 2 layers copper core PCB with Rogers 4350B material. And adopts controlled depth milling and controlled depth drilling process.
This is 2 layers Embedded Copper Core PCB. Any Embedded Copper Core PCB demands, please contact us. We have manufacture copper core PCB over 18 years. So our experience is rich and the quality all can be assure!
The production process of copper substrate refers to the principle of advanced technology and economical rationality, aiming at the excellent quality of the finished product, formulating reasonable and feasible specifications for the processing and treatment of copper substrate to ensure the production of copper substrate The production process is as follows: material cutting→inner layer→lamination→drilling→immersion copper→circuit→diagram→etching→solder mask→character→spray tin (or immersion gold)→gong edge→V cutting (Some copper substrates do not need it) → Inspection → Packaging → Shipping.
1. Automobile: electronic regulator, igniter, power controller, etc.
2. LED lighting: fluorescent lamps, street lamps, downlights, wall washers, industrial and mining lamps, stage lamps, etc.
3. Power module: converter, solid state relay, rectifier bridge, etc.
4. Power supply equipment: switching regulator, DC/AC converter, SW regulator, etc.
5. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
6. Communication electronic equipment: high-frequency amplifier `filter electrical appliances` sending circuit, etc.
7. Office automation equipment: motor drives, etc.
8. Computer: CPU board, floppy disk drive, power supply unit, etc.
Copper Core PCB thermoelectric separation refers to a thermoelectric separation process of Copper Core PCB processing. The circuit part of the substrate and the thermal layer part are on different circuit layers, and the thermal layer part is directly in contact with the heat dissipation part of the lamp bead to achieve the best heat dissipation. The heat conduction effect can be said to be zero thermal resistance. The ability to achieve zero thermal resistance is mainly due to a good base material, generally copper base material. The thermoelectric separation Copper Core PCB has a thermal conductivity of 400W/M.K, which overcomes the shortcomings of the existing Copper Core PCB's insufficient heat conduction and heat dissipation. This process directly conducts the heat generated by electronic components through the heat dissipation area, greatly improving the heat dissipation.
Thermoelectric separation Copper Core PCB technology is relatively complex and difficult to produce, including circuit layer, solder mask layer, silk screen character layer, LED lamp beads are soldered on the top, and the back is a pure copper copper plate.
1. The copper substrate has high density, strong heat carrying capacity, good heat conduction and heat dissipation, and smaller volume under the same power condition.
2. It is suitable for matching a single high-power lamp bead, especially the COB package, so that the lamp can achieve better effect.
3. The thermoelectric separation structure is adopted, and the contact with the lamp bead has zero thermal resistance, which greatly reduces the light decay of the lamp bead and prolongs the life of the lamp bead.
4. According to different design requirements of lamps, different structures (copper bumps, copper concave blocks, thermal layer and circuit layer parallel) can be made.
5. Various surface treatments (immersion gold, OSP, HASL, silver plating, immersion silver+silver plating) can be performed according to different needs, and the reliability of the surface treatment layer is better.
We have focused on the R&D and manufacturing of metal circuit boards for 18 years, allowing us to achieve the first breakthrough in mass production in China: bendable aluminum PCB, ultra-high thermal conductivity (122W) ALC aluminum PCB, copper Core PCB (thermoelectric separation), etc. Products are widely used in LED lighting, high-power power supply, car lighting, new energy batteries, charging pile 5G communication equipment, etc. We also have a professional team with professional technology and rich quality experience, dedicated to solving metal core PCB problems for customers . So any Copper Core PCB needs, please contact us at any time. We are very glad to help your production.
