AMB Ceramic PCB

AMB Ceramic PCB

AMB (Active Metal Bonding/Brazing) is active metal brazing copper clad technology, that is, relying on active metal solder to achieve high-temperature metallurgical bonding of aluminum nitride and oxygen-free copper to achieve high bonding strength and reliability in cold and hot cycles Good and other advantages, the application prospect is extremely broad.


AMB technology refers to a process technology in which AgCu solder containing active elements Ti and Zr wets and reacts at the interface between ceramics and metals at a high temperature of about 800°C, thereby realizing heterogeneous bonding of ceramics and metals.


Unlike DBC Ceramic PCBs, active metal brazing forms a substrate that does not require metallization. AMB Ceramic PCB bonds (brazes) copper directly to a ceramic substrate under high temperature vacuum. The brazing technique can also achieve copper weights up to 800μm on thin ceramic substrates. These heavy copper materials make AMBs ideal for power electronics.

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AMB Ceramic PCB Materials

According to different ceramic circuit board materials, the currently mature and applied AMB ceramic pcbs can be divided into: alumina(Al2O3), aluminum nitride(AIN) and silicon nitride (Si3N4) ceramic pcbs. Physical Properties of AMB Ceramic PCB Materials IA as bellows.












Thermal Conductivity





Thermal Expansion Coefficient

ppm/°C  200~300°C




Bending Strength





Dielectric Constant





Dielectric loss





Breakdown Strength





Volume Resistance





Elastic Modulus






AMB Alumina (Al2O3) Ceramic PCB

Ceramic PCB alumina (Al2O3) board has a wide range of sources and the lowest cost. It is the most cost-effective AMB Ceramic Board with the most mature technology. AMB alumina substrates are mostly used in fields with low power density and no strict requirements on reliability.



AMB Aluminum Nitride (AIN) Ceramic circuit boards have high heat dissipation capacity, so they are more suitable for some high-power and high-current working environments.


AMB Si3N4 Ceramic PCB

Silicon nitride ceramics (Si3N4) have two crystal forms ofα-Si3N4 andβ-Si3N4, of which theαphase is an unstable phase and is easily converted into a stableβphase at high temperature. The content ofβphase in Si3N4 ceramics with high thermal conductivity is generally greater than 40%. With the excellent characteristics of silicon nitride ceramics, AMB Si3N4 Ceramic PCB has excellent high temperature resistance, corrosion resistance and oxidation resistance.


AMB Ceramic PCB Manufacturing Processing


According to different brazing materials, the AMB Ceramic PCB process is currently divided into two types: placing silver-copper-titanium solder sheets and printing silver-copper-titanium solder paste.


The process flow of Si3N4 AMB Ceramic PCB printing silver copper titanium solder paste is shown in the figure below. First, Ag, Cu, and Ti elements are directly mixed in the form of powder to make a slurry, and the Ag-Cu-Ti solder is printed on the silicon nitride ceramic substrate by screen printing technology, and then the copper foil is laminated on the silicon nitride ceramic substrate by hot pressing technology. On the solder, a silicon nitride AMB copper clad laminate that meets the requirements is finally prepared through sintering, photolithography, corrosion and Ni plating processes.


Ag-based powder and its solder paste products for AMB ceramic circuit boards have the characteristics of low oxygen content, high purity and high sphericity. The following is a comparison of AIN Ceramic PCB processing between DBC and AMB.

AIN Ceramic PCB DBC Processing

AIN Ceramic PCB AMB Processing


AMB Ceramic PCB Advantages


(1) Good thermal cycle, good metal bonding, strong weldability and longer service life;


(2) The thermal cycles number of AMB ceramic PCB is 500~5000 times. The number of thermal cycles AMB AIN  ceramic substrateis more than 1000 times, and the number of thermal cycles of Si₃N₄ ceramic substrate is more than 5000 times, with better heat resistance and longer service life; the metal bonding force is above 28n/mm, and the metal layer bonding force is strong.


(3) The ceramic matrix prepared by the AMB process is a high-temperature metallurgical combination of AIN and oxygen-free copper through metal solder. AMB Ceramic circuit board has the advantages of high bonding strength, good reliability in cold and hot cycles, higher thermal conductivity, better copper layer bonding, and also has the advantages of smaller thermal resistance and higher reliability. The expansion coefficient is low, the expansion coefficient is close to that of silicon, and it is widely used in high-power packaging and IGBT electronic packaging.


AMB Ceramic PCB Application

Application fields of AMB Ceramic PCB

High Power Semiconductor Module

High frequency switch

Wind power, solar

Automotive Electronics, Electric Locomotive


IGBT module

5G communication electronics

Medical instruments

High Power LED Lamp

Industrial control, national defense security system

AMB technology realizes the bonding ofAIN and Si3N4 ceramics and copper sheets. Compared with DBC lining boards, it has better thermal conductivity/copper layer bonding/reliability, etc., which can greatly improve the reliability of ceramic substrates. Suitable for high-power and high-current application scenarios, gradually becoming the main application type of high-end IGBT module cooling circuit boards.


For more ceramic substrate technology and production, you can consult BETON Ceramic Circuit, BETON Ceramic is proficient in various processes, ceramic substrate production and processing for many years, has this rich experience h and professional engineer team, many foreign R & D institutions, universities and large enterprises Listed companies are looking for cooperation, welcome to consult at