Now Ceramic PCB has been widely used because of its high thermal conductivity, low CTE, low dielectric constant and chemical erosion resistance.
And we have over many years experience of Ceramic PCB baord manufacturing, and provide high quality Ceramic PCB board to customers all around the world for the application of high power LED, Memory module, Receiving/Transmission module, Multi-layer interconnect board, Solar-panel arrays, Analog/Digital PCB, high insulation & high pressure device, electric power electronic control module, DC-DC module power sources etc.
| Item | Thick Film Technology | AMB Technology | DPC Technology | DCB/DBC Technology |
| The number of layers | 10 layers | 2 layers | 2 layers | 2 layers |
| Material | AI203, ALN, BeO, ZrO2 | ALN, Si3N4 | AI203, ALN, ZrO2, Si3N4 | AI203, ALN, ZrO2 |
| Maximum PCB Size | 200*200mm | 114*114mm | 138*190mm | 138*178mm |
| Min Board Thickness | 0.25mm | 0.25mm | 0.25mm | 0.30mm~0.40mm |
| Max Board Thickness | 2.0mm | 1.8mm | 2.0mm | 1L: 1.3mm; 2L 1.6mm |
| Conductor Thickness | 5um - 13um | 8oz- 22.9oz | 2um - 200um | 3.9oz - 8.6oz |
| Min Line Width | 6/0.15mm | 20mil/0.50mm | 6/0.15mm | 12mil/0.30mm |
| Min Line Space | 8mil /0.20mm | 20mil/0.50mm | 8mil /0.20mm | 12mil/0.30mm |
| Line Width Tolerance | ±5mil (0.125mm) | ±5mil (0.125mm) | ±1mil (0.025mm) | ±5mil (0.125mm) |
| Line Space Tolerance | ±5mil (0.125mm) | ±5mil (0.125mm) | ±1mil (0.025mm) | ±5mil (0.125mm) |
| Min PAD Ring | 6mil (0.15mm) | NA | 3mil (0.075mm) | NA |
| Min BGA PAD Margin | 12mil (0.30mm) | 8mil (0.20mm) | 5mil (0.125mm) | 8mil (0.20mm) |
| Min Soldermask Bridge | 12mil (0.30mm) | 8mil (0.20mm) | 6mil (0.15mm) | 8mil (0.20mm) |
| PTH Dia Tolerance | ±4mil (0.1mm) | |||
| NPTH Dia Tolerance | ±2mil (0.05mm) | |||
| Hole Position Deviation | ±4mil (0.1mm) | |||
| Surface Finishing | AgPd, AuPd, Mn/Ni | OSP/Ni Plating, ENIG | OSP/ENIG/ENEPIG | OSP/Ni Plating, ENIG |
| Outline Tolerance | Laser: +0.2/0.05mm; Die Punch: +0.25/0.20mm | Laser: +0.2/0.05mm | Laser: +0.2/0.05mm; Die Punch: +0.25/0.20mm | Laser: +0.2/0.05mm |
| Thermal Stress | 1 hour @ 350℃ | 3 x 10 Sec @ 280℃ | 15 min @ 350℃ | 3 x 10 Sec @ 280℃ |
| Item | Characteristic |
| Brand | CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba |
| Base Material | AI203, ALN, BeO, ZrO2,Si3N4 |
| Board Thickness | 0.10mm / 0.12mm / 0.15mm / 0.20mm / 0.25mm / 0.30mm / 0.40mm / 0.50mm / 0.60mm/ 0.80mm /1.0 mm/ 1.2 mm / 1.5mm / 1.6mm /1.8mm / 2.0 mm |
| TG Value | 200℃, 250℃,300℃,400℃,500℃,600℃,700℃,800℃ |
| Halogen Free | Yes(optional) |
| ROHS | Yes |
| Flammability rating | 94-v0 |
| Thermal Conductivity (W/m.K, or W/m.C) | 0.2-0.8 |
| Dielectric Strength | 0.635mm; 11KV/mm; 1.0mm; 17KV/mm; 2.0mm; 34KV/mm |
| Wrap & Twist | ≤ 0.75% |
| Thermal Conductivity (W/m.K, or W/m.C) | Al2O3: >= 24; ALN: >=170; Beo: >=240; Si304: 16 - 22 |
| Prototype(<3m²) | Layer counts | Normal delivery | Urgent orders |
| Ceramic PCB | 1 layers | Thick Film:3 - 3.5weeks DCB/DBC/AMB: 3 - 4 weeks DPC: 2 - 3 weeks | Thick Film:1.5weeks DCB/DBC/AMB: 2 - 3 weeks DPC: 1.5 weeks |
| 2 layers | Thick Film:3 - 4 weeks DCB/DBC/AMB:3.5-4.5weeks DPC: 2.5 - 3.5 weeks | Thick Film:2 weeks DCB/DBC/AMB:2.5 - 3.5weeks DPC: 2 weeks | |
| 4 layers | Thick Film: 4 - 6 weeks | 2.5 weeks | |
| 6 layers | Thick Film: 4.5 - 6 weeks | 2.5 weeks | |
| 8 layers | Thick Film: 5 -7 weeks | 3 weeks | |
| 10 layers | Thick Film: 6 - 8 weeks | 3.5 - 4 weeks |
| Mass production | Layer counts | Normal delivery | Urgent orders |
| Ceramic PCB | 1 layers | Thick Film:3 - 3.5weeks DCB/DBC/AMB: 3 - 4 weeks DPC: 2 - 3 weeks | Thick Film:1.5weeks DCB/DBC/AMB: 2 - 3 weeks DPC: 1.5 weeks |
| 2 layers | Thick Film:3.5- 4.5 weeks DCB/DBC/AMB:4-5weeks DPC: 3 - 4 weeks | Thick Film:2.5 weeks DCB/DBC/AMB:2.5 - 3.5weeks DPC: 2 weeks | |
| 4 layers | Thick Film: 5.5 - 6.5 weeks | 3 weeks | |
| 6 layers | Thick Film: 6-7 weeks | 4 weeksp | |
| 8 layers | Thick Film: 7-8 weeks | 5 weeks | |
| 10 layers | Thick Film: 8-9 weeks | 5 weeks |
