DPC (Direct Plated Copper) Ceramic PCB is a technology that combines thin-film circuit and electroplating process. It adopts image transfer method to make circuit on thin-film metallized ceramic board, and then uses perforated electroplating technology to form vertical interconnection between high-density double-sided wiring.
DPC Ceramic PCB has the advantages of high graphic precision and vertical interconnection, and is mainly used in high-power packaging.
Among double-sided ceramic pcbs, DPC ceramic substrates have the characteristics of high circuit accuracy, high surface flatness, high insulation and high thermal conductivity, and are widely used in high-power LEDs, semiconductor lasers, VCSELs and other fields. In the production of multilayer ceramic substrates, The HTCC process and LTCC process are mostly used, and are applied in more complex device fields.
The thin-film copper-plated circuit board made of ceramic substrate becomes DPC ceramic circuit board. And this particular type of thin-film copper-clad circuit board is the one that is most effective at dissipating heat from high-temperature areas.
Contact Us Send Email fiona@beton-tech.com to UsThe DPC Ceramic PCB surface finishing is ENIG or ENIPIG. And the Copper from Min.5um up to 500um. DPC Ceramic PCB Ceramic material is Al2O3,Ain,BeO, and the ceramic pcb thickness is 0.25,0.381,0.5,0.635,1.0mm,1.5mm,2.0mm. Please see the bellow 1 Layer and 2 Layer DPC Ceramic PCB Stackup.
The preparation method of DPC includes vacuum coating, wet coating, exposure and development, etching and other process links. In addition, in terms of shape processing, DPC ceramic boards need to be cut by laser, which cannot be processed accurately by traditional drilling and milling machines and punching machines, so the bonding force and line width are
also finer.
Bonding strength between metal circuit layer and ceramic substrate
Due to the large difference in thermal expansion coefficient between the metal and the ceramic, in order to reduce the interface stress, it is necessary to add a transition layer between the copper layer and the ceramic to improve the interface bonding strength. Since the bonding force between the transition layer and ceramics is mainly based on diffusion adhesion and chemical bonds, metals with high activity and good diffusivity such as Ti, Cr and Ni are often selected as the transition layer (and also as the electroplating seed layer).
Electroplating and Filling
Electroplating and hole filling is also a key technology for the preparation of DPC ceramic substrates. At present, pulse power supply is mostly used for electroplating and filling of DPC substrates. Its technical advantages include: easy to fill through holes, reduce coating defects in holes; surface coating structure is dense and uniform in thickness; high current density can be used for electroplating to improve deposition efficiency.
The DPC process combines the thermal conductivity and excellent circuit performance of ceramic substrates. It is suitable for electronic devices requiring high power, high frequency and high reliability, and provides an important material choice for the electronic packaging industry. DPC ceramic PCB mainly has the following advantages.
The DPC substrate uses ceramics as the base material, which has good thermal conductivity, can effectively conduct and dissipate the heat generated by high-power electronic devices, and improve the reliability and performance of the device.
DPC substrates have low dielectric constant and dielectric loss, and can achieve low signal transmission loss in high-frequency and microwave frequency bands, making them suitable for high-frequency and radio-frequency applications.
DPC substrates have high circuit density and thin line width/fine line spacing capabilities, which can achieve more compact circuit layout and higher circuit density, which is conducive to miniaturization and integrated design.
DPC substrates have high mechanical strength and hardness, can resist environmental stresses such as vibration, impact and thermal expansion, and improve the reliability and durability of devices.
DPC substrates have a low thermal expansion coefficient in high temperature environments, can maintain good dimensional stability, and reduce the risk of mismatch and cracks caused by thermal stress.
The copper film on the surface of the DPC substrate has good welding performance, which can realize reliable circuit connection and welding.
The material and structural design of the DPC substrate make it have high reliability and durability, which can meet the requirements of harsh working environment and long-term use.
DPC ceramic substrate has technical advantages such as high graphic precision, vertical interconnection, and low production cost, and can be widely used in high-power LED lighting, automotive headlights and other high-power LED fields, semiconductor lasers, power electronic power devices, microwave, optical communications , VCSEL, RF devices and other application fields, the market space is very large.
DPC substrates have excellent thermal conductivity in high-power electronic devices and can be used in the manufacture of power amplifiers, inverters, frequency converters, electric vehicle chargers, etc.
DPC substrate has low dielectric loss and excellent high-frequency performance, and is suitable for manufacturing radio frequency power amplifiers, microwave antennas, radio frequency filters, communication equipment, etc.
The excellent thermal conductivity of the DPC substrate can help dissipate heat, improve the efficiency and life of LED lighting, and is often used to manufacture high-brightness LED modules, LED packaging substrates, etc.
DPC substrates are widely used in the field of automotive electronics, and can be used to manufacture power electronic modules, battery management systems, and vehicle communication equipment for electric vehicles.
DPC substrates have good high temperature stability and corrosion resistance, and are suitable for manufacturing electronic devices that work in high temperature environments, such as aerospace equipment, gas turbine control systems, etc.
Direct Plate Coppe (DPC) ceramic PCB process can be applied to many other electronic devices that require high density, high thermal conductivity and high reliability.
Main item | DPC | Thin Film | Thick Film |
Conductor Conductivity | Better conductivity. Heavy copper conductor. | Poor conductivity due to thin film thickness | Good conductivity. Decrease due to the presence of the glassy phase. |
Via Conductivity | Better Via conductivity. Vias filled with pure copper. | Better Via conductivity. Vias filled with pure copper. | Poor Via Conductivity. Vias filled with 50% metal and 50% glass or void. |
Feature Resolution | Good. Depends on copper thickness. | Excellent | Good. Determined by Silkscreen printing capability. |
Production Cost | Low to Moderate. Vias and metal are deposited in the same process. | High cost. Expensive substrates that require grinding and polishing after via deposition. | Low to Moderate. Expensive metal paste. Low-cost substrates and low-cost deposition techniques. |
Thermal Performance | Excellent AIN or Al2O3 substrate and high thermal conductivity metal. | Good AIN or Al2O3 substrate. The thinner metal layer and cannot dissipate heat. | Moderate Al2O3 substrate. Metals are less conductive due to the glassy phase. |
Suitability for Power Applications | Very suitable. Copper conductors carry high currents. | not suitable. Thin film layers cannot carry large currents. | Suitable. Conductors with a glassy phase have moderate conductivity. |
Suitable for High Frequency Applications | Suitable. Good conductivity and line resolution | Very suitable. Excellent line resolution. | Inappropriate |
Green | Yes | Yes | No Often contains lead additives |
So from above comparison, copper plating is superior to other technologies in terms of characteristics and applications. Any DPC Ceramic PCB demands, please contact me at any time.
We have the professional engineer to help to manufacture ceramic boar.
