HTCC Ceramic PCB

HTCC is also known as high-temperature co-fired multilayer ceramics. The manufacturing process is very similar to LTCC. The main difference is that the ceramic powder of HTCC does not add glass material. Therefore, HTCC must be dried and hardened at a high temperature of 1300~1600℃ to form Green embryo, then drill the via hole, fill the hole and print the circuit with the screen printing technology.

LTCC Ceramic PCB

LTCC is also known as low temperature co-fired multilayer ceramic substrate. This technology requires inorganic alumina powder and about 30%~50% glass material to be added with an organic binder to make it evenly mixed into a mud-like slurry, and then Use a scraper to scrape the slurry into flakes, and then go through a drying process to form the flakes of slurry into thin green embryos, and then drill via holes according to the design of each layer to transmit the signals of each layer. The internal circuit of LTCC The screen printing technology is used to fill the holes and print the circuit on the green body respectively. The inner and outer electrodes can use silver, copper, gold and other metals respectively.

DBC Ceramic PCB

Direct copper coating technology (DBC) ceramic circuit board is to use copper oxygen-containing eutectic liquid to directly bond copper to ceramics. The basic principle is to introduce an appropriate amount of oxygen between copper and ceramics before or during the bonding process. , in the range of 1065℃~ 1083℃, because the preparation method of DBC has requirements on the thickness of copper foil, generally not less than 150 ~ 300 microns, so the width-to-depth ratio of such ceramic circuit boards is limited. 

DPC Ceramic PCB

DPC (Direct Plated Copper) Ceramic PCB is a technology that combines thin-film circuit and electroplating process. It adopts image transfer method to make circuit on thin-film metallized ceramic board, and then uses perforated electroplating technology to form vertical interconnection between high-density double-sided wiring.

AMB Ceramic PCB

AMB (Active Metal Bonding/Brazing) is active metal brazing copper clad technology, that is, relying on active metal solder to achieve high-temperature metallurgical bonding of aluminum nitride and oxygen-free copper to achieve high bonding strength and reliability in cold and hot cycles Good and other advantages, the application prospect is extremely broad.

Aluminum PCB/Metal Core PCB

Aluminum PCB called Metal core PCB, MC PCB, IMS circuit boards,is a metal-based copper-clad laminate with good heat dissipation function, and has good thermal conductivity, electrical insulation performance and machinability.

Copper Core PCB

Copper core PCB is a circuit board processed by pure copper copper clad laminate, which is a kind of metal core PCB. Its thermal conductivity is many times better than that of aluminum substrates and iron substrates. It is suitable for high-frequency circuits and areas with large changes in high and low temperature, as well as heat dissipation of precision communication equipment and architectural decoration industries.